Hughes Circuits will be at the 58th - International Microelectronics Assembly and Packaging Society
We will be on-site to answer questions about Wirebonding and packaging on Sept 30- Oct 1, 2025 Booth# 230
The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in San Diego, California. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.
Our event kicks off with Professional Development Courses, followed by 3 days of technical sessions with emphasis on Advanced Package Structures (Heterogeneous Integration, HPC, AI); Advanced Interconnect, Bumping & Wirebond Technologies; RF, MEMS/Sensors, High Rel, WLCSP, Small Body FO; Enabling Materials & Advanced Equipment; and CPI, Modeling, Design, Metrology.
Don't forget to stop by and visit us at the booth# 230
For more information on the IMAPS 2025, check out their website: https://imaps.org/page/IMAPS2025
